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The company has been committed to the development of mixed-signal processes and power IC processes, possessing full-scale wafer manufacturing capabilities across 6-inch, 8-inch, and 12-inch lines. It has constructed a unique process platform system covering: CMOS/Analog, BiCMOS, RF/Mixed-Signal, BCD, HV, e-NVM, and MEMS, along with a series of customized process platforms.
6-inch & 8-inch Roadmaps
| Tech. | BCD | HV CMOS | Mixed-Signal | Logic | e-NVW |
0.13μm/0.11μm |
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0.18μm/0.153μm |
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0.25μm |
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0.35μm |
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0.5μm |
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>0.5μm |
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>1.0μm |
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MEMS | BAW/SAW, Pressure sensor, Microphone sensor, Photoelectric MEMS and Thermopiles sensor, Accelerometer, Gas sensor and Micro-mirror | ||||
Special Device | APD/SPAD, Si-Cap, eDTC | ||||
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12-inch Roadmaps
LP | e-NVM | HV | RF | BCD | ULP | |
90T |
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90nm |
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55nm |
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40nm |
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| Voltage | SGT | LV | SJ | IGBT |
15~30V |
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30~60V | ||||
60~100V |
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100~200V |
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200~400V | ||||
400~800V | ||||
800~1200V | ||||
1200~1700V |
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