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Operating Headquarter：No.14, Liangxi Road, Wuxi City, Jiangsu Province
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Environmental Substance Management
Packaging Platforms
Serves as the product matrix foundation of the enterprise's packaging business, addressing the challenge: "Which package forms can we provide to our customers?" It acts as the carrier for the implementation of all packaging technologies, determining the markets and application scenarios the business can cover.
01
Integrated Circuit (IC) Packaging
Covers QFN/DFN, SOP, QFP, SOT, PLpackaging, and other panel-level fan-out products. Targeted at general IC scenarios, meeting conventional packaging requirements for varying pin counts and miniaturization.
02
Power Discrete Packaging
Centered on the TO-series, focusing on discrete power device packaging, tailored for high-voltage and high-power discrete application scenarios.
03
Plastic Molded Modules
Includes IPM series, SOP/QFN modules, and fan-out products, achieving multi-chip integrated packaging for power integration and miniaturized module scenarios.
04
Gel-Filled Modules
Centered on customized packaging, capable of achieving module packaging with special shapes and specific ingress protection ratings based on customer requirements, adapted to complex operating conditions and bespoke needs.
05
MEMS Packaging
Covers SOP, QFN, and LGA series, providing dedicated low-stress and high-reliability packaging solutions tailored for Micro-Electro-Mechanical Systems (MEMS) devices.
Interconnection Technologies
Serves as the electrical bridge of packaging, addressing the challenge: "How do we achieve electrical conduction between the chip and the external system?" It determines the electrical performance and signal transmission efficiency of the package.
01
Wire Bonding Technology
Achieving short-path interconnection via flip-chip significantly reduces parasitic parameters, boosting electrical performance in high-frequency and high-speed scenarios.
02
Ribbon Bonding Technology
Supports ribbon bonding of various sizes in both aluminum and copper, meeting the high-current and low-resistance interconnection requirements of power devices.
03
Flip-Chip (FC) Technology
Achieving short-path interconnection via flip-chip significantly reduces parasitic parameters, boosting electrical performance in high-frequency and high-speed scenarios.
04
Panel-Level RDL Technology
Enables the re-routing and fanning out of chip I/Os, adapting to the requirements of high-density, high-pin-count advanced packaging.
Die Attach Technologies
Serves as the "anchoring and thermal dissipation core" of the chip, addressing the challenge: "How do we reliably secure the chip onto the substrate?" It fundamentally determines the mechanical stability and thermal dissipation capability of the package.
01
Silver Epoxy Die Attach
Suited for low-power and low-stress scenarios, achieving rapid chip anchoring and reliable conductive connections.
02
Die Attach Film (DAF) Technology
Utilizes film-based adhesives for die attachment, adapted for ultra-thin chips and multi-chip stacking scenarios, while enhancing packaging flatness and consistency.
03
Solder Perform Bonding
Achieves chip-to-substrate soldering fixation via pre-formed solder sheets, tailored for medium-power applications while delivering highly balanced thermal and electrical conductivity.
04
Silver/Copper Sintering Die Attach
Employs nano-silver or nano-copper sintering processes to achieve low-porosity, high-density matrix joints between the chip and substrate, offering superior thermal conductivity optimized for high-power, high-temperature application environments.
05
Solder Paste Die Attach
Utilizes reflow soldering to achieve batch chip-to-substrate fixation, engineered for large-scale mass production while balancing cost and reliability.
06
Wire-Assisted Die Attach
Utilizes wire-assisted die attachment to accommodate highly customized chip architectures and demanding low-stress applications.
07
Silicone Die Attach
Suited for specialized scenarios requiring ultra-low stress and superior electrical insulation, achieving flexible chip fixation.
Support Technologies
Serves as the "structural and thermal backbone" of the package, addressing the challenge: "How do we provide stable physical support and thermal dissipation paths for the chip?" It dictates the overall mechanical strength and maximum thermal performance limits of the package.
01
Lead Frame Support
Utilizes a lead frame as the structural carrier, tailored for conventional package outlines to enable low-cost, high-consistency mass production.
02
BT/FR4 Substrate Support
Employs organic substrates to achieve high-density routing and multi-chip integration, perfectly adapted for complex ICs and system-in-package (SiP) module scenarios.
03
Ceramic Substrate Support
Utilizes ceramic substrates featuring a unique combination of high thermal conductivity, superior electrical insulation, and extreme high-temperature resistance, optimized for high-power and high-reliability environments.
04
Metal Core Substrate Support
Employs metal-base laminates (MCPCB) to drastically enhance heat dissipation efficiency, engineered for power devices with high power outputs and aggressive thermal management needs.
05
Baseplate Support
Employs dedicated baseplates to achieve mechanical reinforcement and auxiliary thermal dissipation, meeting the structural ruggedization needs of high-power modules.
Protection Technologies
Serves as the "reliability defense barrier" of the package, addressing the challenge: "How do we shield the chip against harsh external environmental conditions?" It determines the overall environmental adaptability and long-term operating reliability of the product.
01
Epoxy Molding Compound (EMC) Encapsulation
Utilizes epoxy resin encapsulation to provide physical protection and electrical insulation for both the chip and its internal interconnection structures, matching standard consumer electronics and industrial applications.
02
Silicone Gel Protection
Utilizes silicone potting or coating techniques to achieve flexible elastomeric protection, tailored for specialized scenarios with high vibration levels and stringent low-stress requirements.
Advanced Technologies
Serves as the "performance acceleration engine" of the package, addressing the challenge: "How do we break through the performance bottlenecks of conventional packaging?" It demonstrates the company's technological innovation capabilities and high-end market competitiveness.
01
Top-Side Cooling Technology
Features top-side architectural designs to reinforce the heat dissipation path through the upper surface of the chip, reducing device junction temperature.
02
Dual-Side Cooling (DSC) Technology
Establishes simultaneous upper and lower thermal dissipation paths for the chip, dramatically multiplying thermal dissipation efficiency to suit high-power-density application environments.
03
AP Coating Technology
Employs specialized protective coating processes to enhance the package's resistance against moisture, corrosion, and electrochemical ion migration, strengthening long-term field reliability.
